Research Associate/PhD Position (m/f/d) for Al-Al Wafer Bonding Technology Development for BiCMOS Wafer-level Packaging …

Tätigkeitsprofil:

As a member of the research group "Heterogeneous Integration of Devices & Technologies" within the department Technology you will contribute to a wide range of research activities in the field of high frequency advanced
packaging and heterogeneous integration of SiGe BiCMOS technologies for mm-wave up to THz applications. Your tasks will include the development of process technologies and modules using IHPs 200 mm BiCMOS pilot line and
IHP advanced Al-Al wafer bonding process technologies. In addition, you will contribute to the design and FEM simulations, and the characterization of advanced wafer-level packaging and interconnection technologies. An
international team of 9 scientists, PhD students and engineers is looking forward to you. Flat hierarchies and mutual support are important to us. We see diversity of perspectives as a great advantage for our team.
Your work is suitable both for a research associate or a PhD project. In case of a PhD project, your work is supported by an experienced supervisor and accompanied within the framework of a supervision agreement. We aim together
for a completion within 3-5 years. After one and a half years, the topic will be finally defined and the contract duration will be adjusted accordingly by mutual agreement to the foreseeable doctoral period.

Your tasks:

• Process development of wafer-to-wafer and chip-to-wafer Al-Al bonding interconnection technologies based on IHPs BiCMOS wafer-level packaging technologies
• Process development and process integration within IHPs 200 mm BiCMOS pilot line
• Design and layout of process control monitor test structures for process development and characterization
• Electrical (e.g. DC, RF) and offline characterization (e.g. SEM, FIB) of developed process modules and components
• Support the development of reliability characterization of BiCMOS wafer-level packaging technologies
• Project support and dissemination of research results within high-level scientific journals and conferences
  

Anforderungsprofil:

• Completed university degree (Master/Diploma) in Electrical Engineering, Material Science, or a related field
• Knowledge about semiconductor process technologies with focus on BEOL and wafer-level packaging technologies
• Theoretical and practical experience of wafer-to-wafer and chip-to-wafer thermo-compression and hybrid bonding
• Extensive hands-on experience with FEM simulation tools (e.g. ANSYS Workbench)
• Ability to work independently in a structured and solution-oriented manner
• Team player with strong communication skills and high self-motivation
• German and English language skills mandatory, both written and spoken